Toshiba Debuts One-Gigabit NAND Flash Memory Device
Developed Using MLC Technology, the NAND Chip Pushes the Density Envelope; Doubles Storage Capacity
IRVINE, Calif., Nov. 12 /PRNewswire/ -- Demonstrating its leadership in
flash memory technology, Toshiba America Electronic Components, Inc. (TAEC)*
with its parent company, Toshiba Corporation (Toshiba) today raised the bar
for memory density and lowered cost-per-bit with its 1-gigabit (Gb)
multi-level cell (MLC) NAND electrically erasable programmable read-only
memory (EEPROM).
Co-developed by Toshiba and Sunnyvale, Calif.-based SanDisk
Corporation (Nasdaq: SNDK - news), the new device represents an industry benchmark,
providing the industry's highest density NAND chip currently available using
MLC technology.
Toshiba's 1Gb MLC NAND is manufactured using 0.16-micron (um) technology,
the same technology used to produce the 512 megabit (Mb) NAND, and is based on
MLC technology which allows two bits of data to be stored in one memory cell,
effectively doubling memory capacity.
The result is more data storage for
less money, making the new device ideal for consumer applications such as
digital cameras, cellular telephones and personal digital assistants as well
as streaming audio/video equipment, and other emerging markets for flash
memory technology.
For additional memory, Toshiba plans to produce 2Gb parts
in 2002 by stacking two 1Gb dies into a single thin small outline package
(TSOP).
This can be achieved using the same footprint as existing NAND
devices, eliminating design space concerns.
"The Multi-level cell NAND was developed in response to customer demand
for high-density solid state storage at a lower cost-per-bit," said Paul Liu,
manager of business development for flash memory at TAEC.
"By meeting our
customers' requirements for higher capacity at a lower cost, we are creating
new business opportunities in our existing markets, and paving the way for
emerging applications for higher density embedded flash storage and flash
memory cards."
"In tackling the design tradeoffs to deliver multi-gigabit memory
components, Toshiba has tamed reading and writing to multi-level cell
structures, enabling commercial uses," said Richard Doherty, director of
research for the Envisioneering Group.
"It's the latest example that Toshiba
has extensive experience with migrating raw technology capability into
commercial memory components which address real world market needs."
Toshiba's 1Gb NAND device will be produced at the company's advanced
manufacturing facility at Yokkaichi, Japan and by the FlashVision joint
venture established by Toshiba and SanDisk at Toshiba's Dominion Semiconductor
manufacturing plant in Manassas, Virginia.
Technical Specifications for 1Gb NAND Device
Part Number TC58010FT
Configuration 128 megabits x 8 bits
Power Supply V(CC) = 2.7 Volts (V) - 3.6 V
Page Size 528 bytes
Block Size (32K + 1024) bytes
Program Time 1 milliseconds (ms) per page
Erase Time 2ms per block
Access Time 50 microseconds (us) first access;
50ns serial acces
Package 48-pin TSOP Type 1 (12x20x1.2 millimeters)
Pricing and Availability
Sample quantities of Toshiba's 1Gb MLC NAND are available now and are
priced at $80 each, with full production scheduled to follow in first quarter
of 2002.
Samples of Toshiba's two 1Gb stacked die resulting in 2Gb in
one TSOP package is scheduled to be available in first quarter of 2002.
NAND Flash Background
Toshiba is a recognized pioneer in flash technology and invented NAND-type
flash technology in 1987.
NAND flash is becoming the storage media of choice
for solid state storage applications because of its high-speed programming
capability, high-speed erasing, small block size and low cost.
The sequential
nature (serial access) of NAND-based flash memory provides notable advantages
for these block-oriented data storage applications.
Toshiba's NAND flash
memory products are optimized for general solid state storage, image file
storage and audio for applications such as solid state disk drives, digital
cameras, set-top boxes and industrial storage.
About TAECTAEC offers the industry's broadest line-up of semiconductor, display and
storage solutions for the computing, wireless, networking and digital consumer
markets.
Combining quality and flexibility with design engineering expertise,
TAEC brings advanced next-generation technologies to its OEM customers.
TAEC is an independent operating company owned by Toshiba America Inc., a
subsidiary of the $47.9 billion (FY 2000 recorded sales) Toshiba, the second
largest semiconductor company worldwide in terms of global sales for the year
2000.
Toshiba is a world leader in high-technology products with more than
300 major subsidiaries and affiliates worldwide.
For additional company and
product information, please visit TAEC's web site at chips.toshiba.com .
For
technical inquiries, please e-mail Tech.Questions@taec.toshiba.com.
For further information, please contact:
Suzanne Collier,
suzanne_foxworth-collier@benjamingroup.com, or Penny Capra,
penny_capra@benjamingroup.com, both of Benjamin Group, +1-949-260-1300, for
Toshiba America Electronic Components, Inc.; or Reader Inquiries:
Tech.Questions@taec.toshiba.com.